156X156mm High Efficiency Poly Solar Cell for Panels

Produktbeschreibung

Flagsun's manufacturing covers the photovoltaic value chain from ingot casting and wafering through solar cell production and solar panel assembly.All the cell is with most strict quality standard in every production process .

Features:

1.High conversion efficiency resulting in superior power output performance.
2.Outstanding power output even in low light or high temperature conditions
3.Optimized design for ease of soldering and lamination
4.Long-term stability,reliability and performance
5.Output power tolerance of +/-3%

Efficiency Class	1740	1760	1780	1800	1820	1840	1860	1880	1900	1920	1940
Efficiency(%)	17.4	17.6	17.8	18	18.2	18.4	18.6	18.8	19	19.2	19.4
Pmax (w)	4.23	4.28	4.33	4.38	4.43	4.48	4.53	4.58	4.63	4.68	4.721
Voc (V)	0.622	0.625	0.633	0.635	0.638	0.642	0.648	0.651	0.651	0.653	0.653
Isc (A)	8.623	8.666	8.692	8.725	8.765	8.874	8.948	9.001	9.071	9.120	9.21
Vmax (V)	0.524	0.526	0.531	0.534	0.538	0.54	0.556	0.56	0.563	0.566	0.569
Imax(A)	8.073	8.133	8.180	8.200	8.238	8.277	8.141	8.170	8.213	8.254	8.297
Voltage	-0.35	%/K
Current	0.06	%/K
Current	-0.42	%/K

Physical characteristics:

Dimension:156*156mm±0.5mm
Thickness:Wafer(si):200μm±20μm
Cell:240μm±40μm
Front:Silver bus bars;Dark blue/others silicon nitride anti reflection coating
Back:Silver/aluminum bus bars;Full-surface aluminum BSF

Data under standard testing conditions(STC):1000W/Sq.M, AM1.5, 25ºC

FS-156P	Product	Polycrystalline silicon solar cell
	Dimension	156mm×156mm ±0.5mm
	Thickness(Si)	200µm±15µm
	Front	Blue silicon nitride antireflection coatings 1.4~1.6mm silver busbar ,continuous or discrete 3BB or 4BB
	Back	Full-surface aluminum back-surface field 2.6mm silver continuous or discrete soldering pads

Solar Cell Production Line

Cleaning & Texturing: Wafers are cleaned with industrial soaps and form square-based pyramids also called texture. The texturization helps to reduce the reflection of sunlight.

Diffusion: Wafers that have been pre-droped with boron during the casting process are then given a negative(n-type) surface characteristic by diffusing them with a phosphorus source at high temperature, which in turn creats the negative/positive(n-p) junction.

Etching: Phosphorus diffuses not only into the desired wafer surface but also into the side and the opposite surface to form PN. This gives a shunt path between the cell front and rear. Removal of the path around the wafer edge/edge junction isolation is named etching.

PECVD: By PECVD equipment, the wafers are coated with anti-reflection coating(ARC). It's the blue silicion nitride film to reduce reflection and promote absorption of light.

Printing & Heating: it was adopted by printing paste with screen technology to print the electrodes of silicion solar, and form a good ohmic contact.
Testing & Sorting: It means classifying the cells according to their efficiency tested under the simulated sunlight.

Lieferfähigkeit

Verpackung und Versand

Vorlaufzeit:

Hafen:

Verpackungsdetails:

Produktspezifikationen

Type:: Poly

>=1200 pieces

US 0.85

US {-{

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